Den Haag, Netherlands
Internship Explorer
Internship Explorer
How can advanced packaging technologies contribute to revolutionise short‑range data transfers? Today’s data‑transfer technologies are reaching their limits. To keep up with the growing data volumes in modern systems, future architectures will rely on wireless communication operating at extremely high frequencies, particularly in the 200–300 GHz range. These bands enable ultra‑fast links but also introduce substantial propagation losses, making traditional antenna solutions unsuitable. Advanced packaging technologies address this challenge by integrating antennas and passive components directly within the semiconductor package in a compact, shielded 3D structure. This approach improves signal quality and integration density, and provides higher electrical performance compared to conventional planar designs. Your goal? To design and optimise a high‑efficiency antenna array in package for 200–300 GHz, using our in‑house advanced packaging technologies. Your activities will involve: doing a literature review, design and simulate antenna arrays using software tools such as Matlab or CST/HFSS and reporting internally and to our partners. Where? In the Department of Radar Technology, that is a passionate and creative group of professionals (60 people) dedicated to the specification, development and evaluation of innovative, high-performance MMICs, miniaturised and integrated RF subsystems, antennas and front-ends. The department is at the heart of novel, game-changing radar system and signal processing concepts for the military, space and civil domains.
