





Within ASML, the Scanning Electron Microscopy (SEM) group focusses on fundamental understanding and novel solutions to advance our e-beam metrology tools used in the semiconductor industry. We are developing the next generation models to better predict the performance of our future tools. You, as an intern, can be part of the unique work we do. In this internship assignment, you will create a software framework to model electron optical components using fitted transfer matrices, compacted into a surrogate model. The goal of is to make beam transport simulations much faster by using smart compression methods, without losing accuracy. The framework should also include a calibration tool that can build detailed transfer matrices and compact surrogate models for quick, real-time use. Some of the expected outcomes include: A modular software package for: transfer matrix computation and surrogate model generation with compression; Benchmarking showing: accuracy compared to full simulations and significant speed improvements; Documentation and examples for practical use. This is a Master internship for around 6 - 9 months, working minimum 4 days per week (hybrid). This topic is also suitable for a thesis. The start date of this internship is around February 2026.