Veldhoven, Netherlands
Internship Explorer
Internship Explorer
The Wafer Alignment team works at the heart of ASML’s lithography technology. The group develops methods that help our systems position wafers with extreme accuracy. As system complexity grows, new challenges emerge in alignment performance, diagnostics, and prediction. This internship explores how machine learning can support these future needs. You will help discover data‑driven opportunities that strengthen alignment strategies for next‑generation lithography. In this internship you will explore and prototype new machine learning approaches for wafer alignment. The assignment is open‑ended and allows you to shape the direction of the research. You will work closely with domain experts and gain insight into a highly technical environment. Your main responsibilities will be: * Learn the alignment domain and understand key concepts such as models, mark behavior, measurement noise, and overlay. * Analyze data, workflows, and current challenges in alignment processes. * Identify where machine learning can add value in prediction, optimization, or anomaly detection. * Define a clear problem statement based on your findings. * Research and prototype advanced machine learning methods such as probabilistic modeling or reinforcement learning. This is a bachelors/master’s (thesis )internship for a min 6 months but preferably 9 months , 4–5 days per week (at least 2 days on‑site). The start date of this internship is September 2026.
